Ahead of the launch of MediaTek's Dimensity 9500 SoC this year, more details about the same have surfaced yet again. The newest leak reveals almost everything about the processor, leaving nothing for the imagination.
The information arrives courtesy of Digital Chat Station on Weibo, where the leaker shared all the potential specifications of the Dimensity 9500 chipset. It confirms some of the previously leaked specifications, while revealing a few new ones.
For starters, the Dimensity 9500 could be manufactured on TSMC's N3P process (3nm) with 1x Cortex-X930 clocked at 4.21 GHz, 3x Cortex-X930 cores clocked at 3.5 GHz, and 4x Cortex-A730 cores at 2.7 GHz.
The GPU could be a Mali-G1-Ultra MC12 with a new microarchitecture, improved ray-tracing performance and reduced power consumption as leaked before. The SoC may also boast 16 MB of L3 cache alongside 10 MB SLC caches, combined with ARM's latest SME instruction set support.
The next-gen NPU 9.0 could boast 100 TOPS speed to accelerate AI tasks. Besides, there could be support for 4-channel LPDDR5X RAM and four-lane UFS 4.1 storage. The leak also suggests a new V3+ imaging chip, but it will be exclusive to Vivo devices.
The Dimensity 9500 is expected to power the upcoming Oppo Find X9 series and the Vivo X300 series. The early spotting of Dimensity 9500 on Geekbench suggests over 3,900 and 11,000 points in single and multi-core. The SoC also recently appeared in Oppo Find X9's Geekbench results.
The Dimensity 9500 is tipped to launch on September 22, 2025, a day ahead of Qualcomm's event, where the firm is expected to reveal the Snapdragon 8 Elite Gen 5. We will cover both chipsets and their specifications in detail, so stay tuned!
