Xiaomi's next in-house chipset is coming after XRING O1 and it's called the XRING O3. The long-rumoured XRING O2 is nowhere to be seen. According to a code teardown from XimiTime, there are references buried under the Mi Code database and it points to a complete CPU redesign, faster clock speeds and a more capable GPU.
XRING O3 Specifications (Leaked)
According to earlier rumours, the XRING O2 launch was tipped for around the second quarter of 2026 with Cortex X925 cores. However, the Mi Code references jump straight from O1 to O3 with a completely new CPU architecture. XRING O3's prime core may reportedly hit 4.05 GHz (up from 3.89 GHz on XRING O1).
Not only that, the earlier XRING O1 kept small and medium cores running at 1.8 GHz and 1.9 GHz. On the XRING O3, Xiaomi seems to be removing Cortex-series small and medium cores. According to the report, the XRING O3 may feature a prime core clocked up to 4.05 GHz, Titanium cores clocked up to 3.42 GHz and little cores clocked up to 3.02 GHz.
While there is no confirmation on the exact number of CPU cores, it looks like there would be a 3-cluster layout, like most of the industry chips. In my opinion, Xiaomi is most likely going with an octa-core CPU setup with Arm's new C1-Ultra, C1-Premium and C1-Pro cores, similar to what we have on the Dimensity 9500 chipset.
On the GPU side, the XRING O3 may pack a more powerful GPU (likely Arm's new Mali G1 GPU ), going up to 1.49 GHz. The previous XRING O1 had a peak clock speed of 1.20 GHz. Not to mention, memory bandwidth speed is the same as before at 9600 MT/s.
The XRING O3 is tipped to debut inside Xiaomi's next book-style foldable, which is internally dubbed Q18 (codename "Lhasa") with model number 2608BPX34C. The phone is expected to launch as either the Xiaomi MIX Fold 5 or Xiaomi 17 Fold, likely around August 2026 to match Xiaomi Day on August 8. Note that the "C" in the model number suggests that this will be a China-only release.
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