Samsung Exynos 2700 Leak Reveals Huge GPU and NPU in New Die Shot

The Exynos 2700 will boast a bigger die with a larger GPU and NPU for faster and more efficient AI and Graphics performance

Abubakar Mohammed profile pictureby Abubakar Mohammed
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Samsung Exynos 2700 processor illustration

Image Credit: Beebom Gadgets

Summary

  • Exynos 2700 could be manufactured on Samsung's 2nm SF2P process, boasting better efficiency and thermals.
  • The leaked die layout shows bigger GPU and NPU blocks, pointing to improved AI and Gaming performance.
  • Exynos 2700 will be a deca-core processor, and Samsung claims it could surpass the competition.
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Exynos 2700 broke cover yet again as newly leaked schematics show an ambitious layout compared to its predecessor. A new leak containing the layout of Exynos 2700 has appeared, showcasing the core structure, GPU size and the overall layout of the processor.

Exynos 2700 Could Also Feature Better AI Performance

The spec sheet and die structure leaked by X user @TECHINFOSOCIALS, alongside a second image sourced from @SemiAnalysis_ on X, reveal the Exynos 2700 in full detail. Fabricated on Samsung's cutting-edge 2nm SF2P node process, the processor is shown with a larger die size, featuring 10 CPU cores, cache and the Xclipse 970 GPU.

Information about Exynos 2700, its core clock speeds and die layout
Information about Exynos 2700, its core clock speeds and die layout

Confirming the previous Exynos 2700 leaks, the newest leak also suggests ARM's latest V9.3-A architecture. It features a staggered C2 Ultra configuration, boasting one prime core clocked at a blistering 4.24 GHz, paired with a secondary ultra core running at 3.36 GHz.

The rest of the processing muscle relies on eight C2 Pro cores, evenly split into 3.74 GHz and 2.88 GHz clusters. Beyond processing cores, the SoC supports next-generation LPDDR6 RAM just like Xiaomi's latest XRING O3 chipset. It also features a substantial 40 MB combined cache pool, bridging a 24 MB System Level Cache (SLC) with 16 MB of L3 cache.

Taking a closer look at the actual die structure reveals that the physical floorplan dedicates a massive chunk of real estate to the new Xclipse 970 GPU, alongside a visibly oversized NPU block. The Xclipse 970 is expected to be made in collaboration with AMD and could be based on its RDNA4 graphics. 

Exynos 2700 die layout in detail with NPU and Caches
Exynos 2700 die layout in detail with NPU and Caches

The overall chip area is also estimated to be roughly 140 mm² (mirroring the modem-less footprint of the previous Exynos 2600 processor). This expanded layout indicates that the processor will focus on on-device AI processing and high-end graphical rendering.

Samsung claims Exynos 2700 will surpass Snapdragon 8 Elite Extreme Gen 6 in raw performance, and we can see why. Prior Exynos 2700 Geekbench appearances shed light on its early performance numbers, but the processor should score a lot more in the tests that will surface when we're closer to launch. 

Exynos 2700 is expected to power the Galaxy S27 series, including the Samsung Galaxy S27, Galaxy S27+ and Galaxy S27 Ultra. With the phones expected to launch in February 2027, more information about the processor should surface as we inch closer to launch, so stay tuned.

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